Model NO.
COPPER BASE
Structure
Metal Base Rigid PCB
Dielectric
FR-4
Material
Polyester Glass Fiber Mat Laminate
Application
Aerospace
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Customers Brand
Certification
IATF16949, UL, ISO
Surface Treatment
Gold Finger/Hard Gold
Test
100% E-Test
Layers
1-36 Layers
Copper Thickness
0.5-12oz(18-420um)
Hole Diameter
Min0.05mm
Min. Line Spacing
0.10mm(4mil)
One Stop Service
PCB Assembly, Component Sourcing, Box Building
Board Thickness
0.2-6mm
Solder Mask Color
Green/Black/White/Red/Blue/Yellow
Min. Line Width
0.10mm(4mil)
Max. Finished Board Side
1020mm*1000mm
Delivery
7 Days
Trademark
SNC
Transport Package
Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
Specification
10cm*10cm
Origin
China
HS Code
8522909900